Copper Tungsten uses & Formulation Processes

This is from Intatech: http://intatech.com/CuW.html

Copper tungsten is used for primarily three reasons:


1. Matching coefficient of thermal expansion to a mating material
2. Thermal conductivity for heat sinks
3. Density for RF shielding


There are two formulation processes for CuW

1. Powdered Metal:

A blending of tungsten, copper and various binders are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.

2. Infiltration:

The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.


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Copper Tungsten

This refractory metal composite materials are a combination of tungsten combined with copper or silver. The manufacturing process is to press the refractory, sinter the pressed compact at a high temperature, and infiltrate with copper or silver. All this is done under very closely controlled conditions. The result is a relatively hard materials with superior arc and wear resistance, high physical properties at elevated temperatures, and good electrical and thermal conductivity.


Advantages:
- Higher thermal conductivity
- Low thermal expansion
- High arc resistance combined with good electrical conductivity


Applications:
- Heat Sinks as passive cooling elements of electronic devices
- Electrodes for resistance welding
- Electrodes in electric spark erosion cutting machines
- Arcing contacts and vacuum contacts in high and medium voltage breakers or vacuum interruptions


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High Density Tungsten

High density tungsten alloys are materials with a high tungsten content and low amounts of Ni Fe or Ni Cu.


Advantages:


- High density
- Good machinability
- Good mechanical properties
- High modulus of elasticity
- Harmless to health and to the environment


Applications:


- Electrodes for resistance welding
- Protection shields for nuclear radiation
- Balancing weights 
- Electroheat upsetting anvil block
- High voltage electrical contact
- Substitutional material for uranium
- Balls in bomb


For more info on High Density Tungsten Technical Data go to:
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Pure Tungsten

Tungsten has the highest melting point (3422°C) of all the non-alloyed metals. It can keep its strength and stiffness at high temperatures. Tungsten has good thermal conductivity, excellent corrosion resistance, and lowest thermal expansion of any pure metal.

Tungsten is suitable for aerospace and high temperature uses which include electrical, heating, and welding applications. Hardness and density properties make this metal ideal for making heavy metal alloys such as copper tungsten that are used in armament, heat sinks, and high density applications.

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Molybdenum Properties

Molybdenum can withstand extreme temperatures and keep its strength and stiffness at high temperatures. The melting point of Molybdenum is 2623°C.

The ability of molybdenum to withstand extreme temperatures without significantly expanding or softening makes it useful in applications that involve intense heat, including the manufacture of aircraft parts, electrical contacts, industrial motors, and filaments. Molybdenum is also used in alloys for its high corrosion resistance and weld ability.

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Cu/Mo70Cu/Cu (CPC) Heat Sinks

Cu/Mo70Cu/Cu (CPC) is a sandwiched composite similar to Cu/Mo/Cu comprising a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu Mo70Cu and Cu layers is 1:4:1. It has different CTEs in the X and the Y direction. Its thermal conductivity is higher than those of W/Cu, Mo/Cu, Cu/Mo/Cu and it is much cheaper.


Advantages of CPC Heat Sinks:


- Can be more easily stamped into components than CMC
- Very strong interface bonding that can resist 850 degrees C heat shock repeatedly 
- No magnesium
- Higher thermal conductivity at lower cost


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Cu/Mo/Cu Heat Sinks (CMC)

Cu/Mo/Cu (CMC) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.


Advantages of CMC Heat sinks:


1. Large size sheets available (length up to 400mm, width up to 200mm)
2. Can be stamped into components
3. Very strong interface bonding that can resist 850°C heat shock repeatedly
4. Adjustable CTE matching that of semiconductor and ceramic materials
5. High thermal conductivity
6. No magnetism


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Molybdenum-Copper Heat Sinks

Molybdenum-Copper heat sinks are composites of molybdenum and copper. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the content of molybdenum. Mo-Cu is much lighter than W-Cu so that it is suitable for aeronautic and astronautic applications.  These heat sinks are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.


Advantages of Molybdenum-Copper heat sinks:


High thermal conductivity since no sintering additives have been used


Excellent hermeticity


Relatively small density


Stampable sheets available (Mo content no more than 75 wt%)


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Copper Tungsten Heat Sinks

They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.


Advantages of CuW Heat Sinks:

• High thermal conductivity
• Excellent hermeticity
• Excellent flatness, surface finish, and size control

Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today.  For more information, please visit us at http://www.torreyhillstech.com 

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Introduction to THT Heat Sink Materials

Torrey Hills’ heat sinks manufacturing facility specializes in the R&D and production of high-tech electronic packaging materials, namely copper tungsten, molybdenum copper, and copper molybdenum copper heat sinks. The facility is top in the field of electronic packaging materials with advanced material manufacture technologies, complete materials detective devices and modern management system.

Our products are widely used in applications such as optoelectronics packages, RF and microwave packages, C packages, laser submounts, etc.

Visit us at www.torreyhillstech.com and learn more about our heat sink materials

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