This is from Intatech: http://intatech.com/CuW.html
Copper tungsten is used for primarily three reasons:
1. Matching coefficient of thermal expansion to a mating material
2. Thermal conductivity for heat sinks
3. Density for RF shielding
There are two formulation processes for CuW
1. Powdered Metal:
A blending of tungsten, copper and various binders are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.
2. Infiltration:
The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.
Visit us at www.torreyhillstech.com
like us on facebook:
facebook.com/torreyhillstechnologies
Showing posts with label torrey hills technologies heat sinks copper tungsten uses formulation processes intatech base plate submount heat spreader flange. Show all posts
Showing posts with label torrey hills technologies heat sinks copper tungsten uses formulation processes intatech base plate submount heat spreader flange. Show all posts
Thursday, July 28, 2011
Subscribe to:
Comments (Atom)