Thursday, July 28, 2011

Copper Tungsten uses & Formulation Processes

This is from Intatech: http://intatech.com/CuW.html

Copper tungsten is used for primarily three reasons:


1. Matching coefficient of thermal expansion to a mating material
2. Thermal conductivity for heat sinks
3. Density for RF shielding


There are two formulation processes for CuW

1. Powdered Metal:

A blending of tungsten, copper and various binders are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.

2. Infiltration:

The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.


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